The Department of Industrial Technology (DoIT) under the Ministry of Economic Affairs (MOEA) is showcasing 14 cutting-edge innovations at the Innovation Technology Pavilion during the Electronic Equipment Exhibition of 2026 Touch Taiwan, starting April 8. Among the highlights is a next-generation panel-level packaging (PLP) metallization technology developed by the Industrial Technology Research Institute (ITRI), which aims to accelerate the transformation of Taiwan's display industry into advanced semiconductor packaging.

To help panel makers tap into the emerging PLP market, ITRI's technology addresses key bottlenecks in high aspect ratio metallization and coating processes. By introducing a fully wet processing approach, the solution improves coating continuity in fine structures while reducing overall production costs by 30%. The technology has already attracted leading Taiwanese companies, including TPK Holding, SynPower, Jetchem International, and Asahi-Utou Technology, fostering the development of a localized supply chain for materials and equipment and laying the foundation for a robust PLP ecosystem.

According to DoIT Deputy Director General Chung-Pin Chou, the global semiconductor industry continues to expand, driven by demand from artificial intelligence, high-performance computing, and smart manufacturing. Based on market research by Global Information, the PLP market is projected to grow from US$400 million in 2025 to US$2 billion by 2030-a fivefold increase. Over the years, MOEA has supported the development of semiconductor equipment and key modules through national R&D programs, thereby strengthening domestic capabilities and enabling Taiwanese companies to enter high-value global supply chains.

The Innovation Technology Pavilion highlights three key breakthroughs supported by MOEA programs. ITRI's next-generation PLP metallization technology overcomes bottlenecks in through-glass via copper filling and high aspect ratio coating by adopting a fully wet process, improving coating continuity and reducing production costs by 30%, attracting leading Taiwanese companies to accelerate ecosystem development. In addition, ITRI's wafer-based plasma sensing system integrates 19 micro-sensors and intelligent algorithms onto a 12-inch wafer, enabling real-time, in-line monitoring of plasma uniformity without interrupting production, and improving measurement efficiency by up to tenfold to enhance yield and process stability. Meanwhile, the Metal Industries Research & Development Centre (MIRDC) has developed a low vapor pressure precursor vaporization and delivery system that ensures stable gas flow for uniform thin-film deposition, supports high aspect ratio (20:1) anti-etch coatings, improves process yield by 2-3%, and significantly reduces annual maintenance costs, further driving the advancement of Taiwan's domestically developed semiconductor equipment capabilities.

Looking ahead, DoIT will continue to invest in national science and technology programs and the A+ Industrial Innovation R&D Program to support research institutes in advancing semiconductor equipment and key module technologies. Through close collaboration between industry and research organizations, MOEA aims to help Taiwan's semiconductor equipment sector overcome technical barriers and expand into global markets, positioning Taiwan as a trusted strategic partner in advanced manufacturing and further strengthening its leadership in the global supply chain.