低流動性介面熱傳導材料技術

航空零組件及衛星地面基站模組技術開發暨整合計畫

液態金屬在國內外相關產業雖已有成熟之商品，但本次技術開發著重在維持同等導熱性能並降低該材料之流動性來減少容易出現溢流導致電子短路之風險，較符合實際應用場域。而現有國內外之產品開發方向是利用不同的封裝手法來減少溢流之風險。

While liquid metals are already commercially available in related industries both domestically and internationally, this technological development focuses on maintaining equivalent thermal conductivity and reducing the material's fluidity to minimize the risk of overflow and subsequent electronic short circuits, which is more in line with practical application scenarios. Existing product development trends both domestically and internationally utilize different packaging methods to reduce the risk of overflow.