技術摘要（英）
A lifespan prediction correction model has been developed, incorporating factors such as junction temperature (∆Tj), Averge temperature (Tm), and opening time (ton). Using the Coffin-Manson experimental life model and the solder layer plastic strain increment Δε, a parameterized experimental curve was fitted. This model accurately predicts the lifespan, with a prediction accuracy of 95%. The model effectively accounts for the thermal and mechanical stress factors influencing the reliability of the component, providing a precise tool for forecasting the long-term performance and durability of the device under varying operating conditions.